1. Several glass frit pastes are commercially available, e . g. 2. The printed glass frit structures are heated to form compact glass. 3. The auxiliary electrode may be isolated from the working electrode using a glass frit . 4. Two options are used, a glass frit bond ring or a metallic bond ring. 5. Early covered resonators with glass frit seals were unstable because contaminants outgassed from the sealing material. 6. The most common wafer-level packaging techniques are based on anodic and glass frit wafer bonding. 7. Further, the bonding yield of glass frit bonded wafers is very high, normally > 90 %. 8. The risk of glass frit flowing into the structures can be prevented by optimization of the screen printing process. 9. For more demanding applications, the filter paper in the latter two may be replaced with a sintered glass frit . 10. Glass frit as a dielectric material does not need additional passivation for preventing leakage currents at process temperatures up to 125 �C.
Mobile